Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.

Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...

Nvidia's most sophisticated AI chip, named Blackwell, is composed of several chips merged using a complex chip on wafer on ...

Broadcom, under CEO Hock Tan, now finds itself at the epicentre of one of the world’s fastest-growing markets — AI chips ...

As reported by Globes and confirmed to DCD, Nvidia is developing a 30MW data center - making it one of the largest in the ...