Nvidia, TSMC

Nvidia CEO Huang confirms its TSMC advanced packaging needs are shifting: report
CEO Jensen Huang confirmed its advanced packaging needs from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) are changing, according to a report by Reuters. Blackwell, Nvidia's latest artificial intelligence chip,
Nvidia CEO says its advanced packaging technology needs are changing
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders.
Nvidia Expands Capacity with TSMC's Advanced Packaging
Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The company aims to increase capacity, not reduce it, as demand grows. Jensen Huang,
Nvidia CEO says advanced packaging needs are changing
TAICHUNG, Taiwan (Reuters) -- Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders.
Nvidia increases demand for TSMC's advanced packaging
Nvidia (NASDAQ:NVDA), the U.S. AI chip giant, continues to demand advanced packaging from Taiwan Semiconductor Manufacturing Co (TSMC), its main contract chipmaker, although the type of technology it requires is shifting,
US announces $1.4 bln support for next-generation semiconductor advanced packaging
The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...
The Taipei Times1d
TSMC aims to grow revenue 25 percent
Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), a major chip supplier to Nvidia Corp and Apple Inc, yesterday said it aims ...
TweakTown13d
TSMC to begin equipment move-in at its biggest CoWoS packaging plant in Taiwan in April 2025
TSMC to begin equipment move-in at its biggest CoWoS advanced packaging and testing plant, AP8 in the Southern Taiwan Science ...
Electronic Design21h
Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
TSMC’s Mixed Signals: Hold Rating Amid Strong Demand and Future Headwinds
Krish Sankar, an analyst from TD Cowen, maintained the Hold rating on TSMC (TSM – Research Report). The associated price target was raised to ...
Digi Times1d
TSMC expects 5% sequential revenue drop in 1Q25, plans record capex for 2025
TSMC expects to post revenues of between US$25 billion and US$25.8 billion in the first quarter of 2025, representing a ...
Electronics Weekly1d
TSMC 2025 capex expected at $38-42bn
TSMC estimates 2025 capex at $38-42 billion with 70% spent on advanced processes, 20-30% on mature processes, and 10-20% on ...
US Unveils New Rules to Curb Flow of Advanced Chips to China
The US unveiled a fresh round of regulations aimed at keeping advanced chips produced by Taiwan Semiconductor Manufacturing ...