Siemens Digital Industries Software has announced the extension of its Veloce hardware-assisted verification platform to ...

Cadstrom, an AI expert system that enables electrical engineers to speed up the design of electronic devices, has raised ...

MediaTek announces the launch of the Dimensity 8400, a premium smartphone chip offering a powerful Gen-AI performance.

At 2024 IEDM, imec and its partners within the Q-COMIRSE project (Ghent University, QustomDot BV, ChemStream BV and ams OSRAM ...

In the age of AI, smartphone experiences are becoming ever more intelligent, immersive, and dynamic. Consumers are already ...

Nordic Semiconductor and Kigen, a developer of eSIM security solutions for the IoT, have announced a technical collaboration ...

Microchip Technology has unveiled a new family of ATA650x CAN FD System Basis Chips (SBCs). These chips combine a fully ...

The global tech industry has faced substantial layoffs in 2024, with approximately 150,000 jobs eliminated by companies.

Wire bonding is a critical yet often overlooked process in electronics manufacturing, but plays an indispensable role.

ECSN projects a return to growth for the electronics components market in 2025 after a very weak performance in 2024.

The SoM features an NVIDIA Ampere architecture GPU with tensor cores and a 6-core Arm CPU, facilitating multiple concurrent ...

Dracula Technologies, a developer of energy-harvesting solutions, and CoolR to offer sustainable retail IoT solutions.