SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...
This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...
Sandisk, freshly spun off from Western Digital, has announced a new SSD maxing out PCIe 5.0 speeds at only 7W power draw. The drive will be released in Q2 2025.
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