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Electronic Design
42m
Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
Hosted on MSN
3m
Leica Announces a Speedy New SL3-S With Unlimited Open Gate 6K Video
To celebrate the company’s 100-year history, Leica has announced a follow-up to their popular SL3 mirrorless camera. The new ...
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