Samsung Electro-Mechanics will participate in the 'KPCA Show 2026' (International Semiconductor Substrate & Advanced ...

All-atom molecular dynamics simulations examined how gold tracks embedded in cylindrical silver substrates could guide the ...

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A new supply-chain report suggests that Apple is seeking to be an early player in what some believe will be the next big thing in chip development: printed circuit boards (PCBs) made from glass ...

Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how ...

Many of today's electronic devices—from the semiconductors in your cell phone to the photovoltaic cells in your solar panels—are built on thin-film substrates. The thin film is an electrically ...

In a significant advancement for sustainable industrial practices, a team of international researchers have conducted a systematic review, uncovering 299 alternative substrates across 12 industries ...

The big picture: Taiwan's E&R Engineering is fully committing to glass substrates for advanced packaging. Late last month, the company hosted an event in Taipei to launch its new "E-Core System" ...

As artificial intelligence pushes chips toward greater speed and density, Samsung Electro-Mechanics is betting that the next battleground will be ...

Underlying the hype for SiC (silicon carbide) and the future potential of GaN (gallium nitride) for EV power electronics, challenges remain for both technologies. While OEMs, tier-one suppliers, and ...