SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables massively-parallel access to the flash memory sub-arrays. This allows for ...
Kioxia and Sandisk also shared plans for the upcoming 9 th generation 3D flash memory. Enabled by their unique CBA technology, the companies can combine the new CMOS technology with an existing ...
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